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08175 Pharmaceutical Surface Defects: Correlation Between Microstructural Artifacts and Electropolishing Results

Product Number: 51300-08175-SG
ISBN: 08175 2008 CP
Author: Nathan C. Eisinger, R. Keith Raney, and Richard E. Avery
Publication Date: 2008
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With the recent interest in superaustenitic stainless steels and nickel-base alloys for materials of construction in pharmaceutical applications, specifications have been created to assure the best possible finish after electropolishing. These specifications require extensive microstructural examinations for the presence of inclusions and secondary phases. By excluding these phases, electropolishing defects will be minimized. It has been shown that banding of secondary phase will cause significant indications during electropolishing, but there has been minimal evidence to determine the effect of other inclusions. This paper will discuss some of the microstructural defects and their correlation to surface defects. Furthermore, some of the causes for these microstructural defects will be discussed.
With the recent interest in superaustenitic stainless steels and nickel-base alloys for materials of construction in pharmaceutical applications, specifications have been created to assure the best possible finish after electropolishing. These specifications require extensive microstructural examinations for the presence of inclusions and secondary phases. By excluding these phases, electropolishing defects will be minimized. It has been shown that banding of secondary phase will cause significant indications during electropolishing, but there has been minimal evidence to determine the effect of other inclusions. This paper will discuss some of the microstructural defects and their correlation to surface defects. Furthermore, some of the causes for these microstructural defects will be discussed.
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