Server maintenance is scheduled for Saturday, December 21st between 6am-10am CST.

During that time, parts of our website will be affected until maintenance is completed. Thank you for your patience.

Menu
Search
Filters
Close
Menu

Use GIVING24 at checkout to save 20% on eCourses and books (some exclusions apply)!

02146 FAILURE OF ELECTRONIC EQUIPMENT BY ELECTROMIGRATION

Picture for 02146 FAILURE OF ELECTRONIC EQUIPMENT...
Available for download
Product Number: 51300-02146-SG
ISBN: 02146 2002 CP
Author: Jose Colon, Behzad Bavarian, and Rosa Leon
$0.00
$20.00
$20.00
Electromigration (EM) is the mass transport of a metal due to the momentum transfer between conducting electrons and diffusing metal of the wire. Electrons flow through wires on a chip and collide with metal atoms producing a force on the atoms that causes the wires to break over the chips lifetime. Current thin film interconnects contain small grains with many grain boundaries that act as conduits for rapid diffusion. This combination of high current density and fast diffusion at low temperatures was disastrous for circuit reliability. The previous solutions for electromigration problems were to increase the width of the wire. This type of fix is no longer feasible with the trend for smaller and smaller circuitry. Electromigration will require more innovative technologies and research. The trend for smaller circuitry and methods for minimizing electromigration are examined. This paper will show the progress of the current electromigration investigation. It will include a brief description of the studied device and all the work done before, during and after testing the Au electromigration structures. It will also cover a small portion of an oxidation study in Cu conductors due to Joule's heating.
Electromigration (EM) is the mass transport of a metal due to the momentum transfer between conducting electrons and diffusing metal of the wire. Electrons flow through wires on a chip and collide with metal atoms producing a force on the atoms that causes the wires to break over the chips lifetime. Current thin film interconnects contain small grains with many grain boundaries that act as conduits for rapid diffusion. This combination of high current density and fast diffusion at low temperatures was disastrous for circuit reliability. The previous solutions for electromigration problems were to increase the width of the wire. This type of fix is no longer feasible with the trend for smaller and smaller circuitry. Electromigration will require more innovative technologies and research. The trend for smaller circuitry and methods for minimizing electromigration are examined. This paper will show the progress of the current electromigration investigation. It will include a brief description of the studied device and all the work done before, during and after testing the Au electromigration structures. It will also cover a small portion of an oxidation study in Cu conductors due to Joule's heating.
PRICE BREAKS - The more you buy, the more you save
Quantity
1+
5+
Price
$20.00
$20.00
Product tags
Also Purchased
Picture for 00805 CATHODIC PROTECTION CRITERIA AND
Available for download

00805 CATHODIC PROTECTION CRITERIA AND PRACTICAL COMPLETION ISSUES FOR CP OF REINFORCED CONCRETE STRUCTURES

Product Number: 51300-00805-SG
ISBN: 00805 2000 CP
Author: Atef Cheaitani
$20.00
Picture for 00062 MECHANISTIC MODELING OF MASS TRANSFER IN
Available for download

00062 MECHANISTIC MODELING OF MASS TRANSFER IN THE LAMINAR SUBLAYER IN DOWNHOLE SYSTEMS

Product Number: 51300-00062-SG
ISBN: 00062 2000 CP
Author: M. S. High, J. Wagner, S. Natarajan
$20.00
Picture for NACE 01116
Available for download

NACE Publication 01116-SG, “State-of-the-Art Report on Evaluating Cathodic Protection Systems on Existing Reinforced Concrete Structures”

Product Number: 21411-SG
ISBN: 1-57590-248-2
Publication Date: 2016
$109.00

Information and test methods available to evaluate the effectiveness of cathodic protection (CP) systems used to protect the steel reinforcement of conventionally reinforced atmospherically exposed concrete structures.
Categories
Industry
Recently viewed
Popular tags
View all

Association for Materials Protection and Performance

© AMPP All Rights Reserved.
Membership Terms of Content Use
Contact Customer Support