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Numerical simulation was used to calculate the potential and current distribution for cases with: (1) electrical isolation between grounding system and CP system; (2) different electrical grounding materials; (3) Optimization of anode beds (near/remote); (4) isolation of partial grounding electrodes.
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Ground-supported structures such as slabs-on-ground, walkways, concrete pavements, storm-water channels, pipe supports, and industrial floors are exposed to harsh environmental conditions in the Middle East region, characterized by large temperature and humidity fluctuations. The highly varying temperature and humidity regimes accelerates moisture diffusion and the associated drying shrinkage in concrete slabs. The external restraint on these slabs by the subgrade and the internal restraint from the embedded reinforcement causes cracks on the surface of these slabs.
High voltage direct current (HVDC) transmission results in a large direct current will into the earth. This may cause interference on a buried pipeline even though it is far from the earth electrode. In this work, numerical simulation was used to study the mechanism and influencing factors of HVDC interference.
The progress of science and technology, and the large-scale construction of infrastructures, not only bring about challenges to cathodic protection (CP), but also provide new opportunities for CP technologies. Challenges and opportunities promote the development of the CP technologies. In recent years, CP technology has achieved great development particularly in the following four aspects: first, numerical simulation calculation technology of cathodic protection, which has made remarkable achievements in theoretical research and practical application; second, data remote monitoring technology of cathodic protection, which has improved the management level of cathodic protection system by combining wireless transmission system and GPRS network; third, great progress has been made in the aspects of AC and DC stray current corrosion mechanism, evaluation method and elimination technology; fourth, the development of photocathodic protection technology.